Chemical Nickel-Gold
Since early 1990s the alloy surface (nickel / phosphorus & gold) is one of the most versatile surfaces. In this method, a nickel layer forms the diffusion barrier between copper and solder alloy. The gold is dissolved in the solder joint and the liability / IMC formation is done with the nickel layer. Electroless nickel-gold requires an upstream copper activation to start the nickel deposition. The nickel layer increases mechanical vias and increases the abrasion resistance.
General info
layer thickness:3 – 6 μm NiP and 0.05 – 0.12 μm Au
storage time:12 Months
low / medium / high P systems : (<7; 7-10; >10 % P)
Layer properties
- low / medium / high P systems (<7, 7-10;> 10% P)
- Layerthickness 3 – 6μm NiP and 0.05-0.12μm Au
- Autocatalytic nickel deposition
- Gold protects nickel from oxidation
- Reliable multi-functional surface
- suitable for Al-wire bonding
- Growth of the nickel-phosphorus layer of activated copper
Advantages
- Suitable for multiple Pb-free soldering
- Planarity for SMT
- Diffusion barrier (nickel), prevents the solution of copper in the solder
- Long storage time (12 months), excellent resistance against ageing
- E-Test Compatible
- Suitable for contact switches
- Good resistance in corrosive environments
- Suitable for AL-wire bonding
- Suitable for high aspect ratio boards
Equipment
Compacta 30 chem. Nickel-Gold
This machine can perform nickel and gold plating for printed circuit boards up to a size of 200x300mm. 5 PVC tanks, 2 PP tanks all about 10 liters, 3 Teflon radiators all with thermostatic, 5 Digital Timer, bath movement (adjustable), all tanks with ball valve drain. spray rinse with foot switch, flushing pressure adjustable. Stand-alone machine. Connection: 230 V
Reviews
There are no reviews yet.