PHONE

+213 (0) 23 61 19 31 +213 (0) 23 61 19 32

EMAIL

fabrication@almitech-dz.com

Upgrade Pick&Place Line 2

Category:

Description

Upgrade Bungard Pick&Place SMT 3000
Line 2 Prototypes and small series

Dispensing of solder paste or glue with the Bungard StenPrint 3000 and Bungard SMD-Stencils

Image
Image

Component Pick&Place with the Bungard SMT 3000 BASIC Light or SMT 3000 PLUS Light
(without dispensing function)

Reflow soldering with the Bungard Reflow Oven HotAir06

Image

System features:

Max. substrate size: 300 mm x 370 mm

Max. placement area: 245 mm x 350 mm

Max. thickness of pcb: 0,5 mm bis ~ 4 mm

Height below pcb: min. 39 mm, max. 50 mm

Components: Chip 0201 bis QFP 0,65 mm Pitch

Max. component height: ca. 16 mm

Pre-heat temperature: 60-260°C

Reflow time: 0-999 Sekunden

Reflow temperature: 90-300°C

Brand

BUNGARD

Reviews

There are no reviews yet.

Be the first to review “Upgrade Pick&Place Line 2”

Your email address will not be published. Required fields are marked *