BASISLINE LEVEL 3

Description

PCBs like in Level 2 – in addition with negative resist and galvanic plating through hole

additional in Level 3

raw material cut to size
(Ne-Cut)

CNC-drilling and
contour routing
(BUNGARD CCD/2)

brushcleaning
(RBM 300)

galvanic plating
through hole
(COMPACTA 30)

brushcleaning
(RBM 300)

lamination
of tenting resist
(RLM 419p)

vacuum exposure
(HELLAS)

spray developing
(SPLASH D)

spray etching
stripping of tenting resist
(SPLASH CENTER)

brushcleaning
(RBM 300)

chemical tinning
(SPLASH CENTER)

lamination
of solder mask
(RLM 419p)

exposure of solder mask
(HELLAS)

spray developing
(SPLASH D)

curing of solder mask
(HELLAS or hot air oven)

CNC-V-cut or contour routing
(Bungard CCD/2)

Fine-line technology in industrial quality with green solder mask and blue components printing!
(To make components printing repeat the steps laminating, exposure and developing with blue tenting resist!)
Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time!
Track resolution: better 150µm!
Film production with laser printer or bubble jet or local film supplier.
Processing time: approx. 2 hours
maximum throughput: 0,8m² / 8h
maximum usable size: 210 x 300 mm
3 more machines than Level 2: Ne-Cut for board cutting, RBM 300 for cleaning and roughening and COMPACTA 30 for galvanic through hole plating (PTH)