Splash
Spray etching machine for laboratory use with integrated static rinse. Machine is suitable for double sided material. Special emphasis was put on ergonomical and clean etching and rinsing as well as on low chemical drag out.
General information
Power supply::230 V~, 50 Hz, approx. 1,5 kW (XL)
Dimensions (LxWxH):800 x 650 x 1200 mm (XL)
Tank capacity:approx. 40 l (XL)
Weight:approx. 40 kg (XL)
Features
- Maintenance free system with self-cleaning nozzles and magnetic pump
- Etching speed of 35 μm Cu within 90 seconds (warm Fe-III-Cl).
- Big window to the etching chamber made from transparent PVC.
- Maximum board size: 210 x 300 mm. (Splash XL: 300 x 400 mm)
- Line resolution better than 0.1 mm (100 μm)
- Suitable for all common etchants
- Lid to the etching chamber with safety switch
- Removable board holder made from Titanium and PVC. Can be locked in drip-off position
- Easy access to the etching chamber.
- Strong 1000 W Quarz heater, controlled by thermostat
- Overheat fuse
- Digital timer with count down, auto reset and beeper.
- Integrated rinsing zone with drip off holder.
- 3 cog valves for all tanks
- Suitable for spray developing
Splash
Power supply: 230 V~, 50 Hz, approx. 1,5 kW
Dimensions (LxWxH): 600 x 660 x 1200 mm
Tank capacity: approx. 25 l
Weight: approx. 35 kg
Working Level: 900 mm
Etchingformat: 210 x 300 mm
Splash XL
Power supply: 230 V~, 50 Hz, approx. 1,5 kW
Dimensions (LxWxH): 800 x 650 x 1200 mm
Tank capacity: approx. 40 l
Weight: approx. 40 kg
Working Level: 900 mm
Etchingformat: 300 x 400 mm
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